Semiconductor Equipment

Laser Holographic Anti-Counterfeiting Marking equipment with 2500W Output Power

6inch 8inch 12inch LPCVD Oxidation Furnace for Uniform Thin-Film Deposition of Polysilicon and Silicon Oxide

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch

Thermo Compression Anodic Bonding Equipment Thermal Pressure Bonding Si Cu Al-Ge Material 600°C 2-8inch

Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity

Automatic Double Cavity Semiconductor Fast Annealing Furnace Compatible With 6inch 8inch 12inch Wafer Heat Treatment Equipment 200-1300℃

Sic Resistance Growth Crystal Furnace High Temperature Heating Ingot 6 Inch 8 Inch 12 Inch

Sic Raw Material Synthesis Furnace 50kg Resistance Preparation Of High Purity Sic Crystal

Sic Growth Furnace PVT Method 6inch 8inch 12 Inch Low Energy Consumption

Monocrystalline Silicon Double Station Square Machine 6/8/12 Inch Burr ≤0.5mm High Precision ±0.05mm

Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups

Microfluidic Laser Equipment For Semiconductor Wafer Processing

Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material

Microjet Laser Equipment High Energy Pulsed Laser Chip Microhole And TSV Processing LASER MICROJET LMJ

Gallium Arsenide Optical Fiber Temperature Sensor Small Probe Size 0.5mm Temperature Measurement Accuracy ±0.1℃

GaAs Fiber Optic Temperature Sensor GaAs Package Temperature Sensor Quartz Glass Fiber Conduction

Semi-automatic Room Temperature Bonding Machine 2/4/6/8/12inch Compatible Material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass

Sapphire ky crystallization furnace kyropoulos foam process growth sapphire crystal 200kg 400kg

SiC Diamond Wire Cutting Machine Precision Guidance SiC Crystal Rod Cutting

VIS-NIR Camera CCD Contour-IR Contour-M Digital Camera 400-1700nm Multispectral Camera